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Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals)

Solicitation Number: DARPA-BAA-12-50
Agency: Other Defense Agencies
Office: Defense Advanced Research Projects Agency
Location: Contracts Management Office
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Added: Jun 07, 2012 1:32 pm
The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniques needed to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks.

See the full DARPA-BAA-12-50 document attached.
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DARPA-BAA-12-50 document

Other (Draft RFPs/RFIs, Responses to Questions, etc..)
DARPA-BAA-12-50 document
Posted Date:
June 7, 2012
Description: DARPA-BAA-12-50 document
Description: Attachment 1: Approved Proposer Checklist
3701 North Fairfax Drive
Arlington, Virginia 22203-1714
Dr. Avram Bar-Cohen,
Program Manager