Accessibility Information

Users of assistive technologies such as screen readers should use the following link to activate Accessibility Mode before continuing: Learn more and Activate accessibility mode.

ICECool Applications (ICECool Apps)

Solicitation Number: DARPA-BAA-13-21
Agency: Other Defense Agencies
Office: Defense Advanced Research Projects Agency
Location: Contracts Management Office
  • Print


There have been modifications to this notice. You are currently viewing the original synopsis. To view the most recent modification/amendment, click here
Added: Feb 06, 2013 4:09 pm
ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects. See the full DARPA-BAA-13-21 document attached.
Please consult the list of document viewers if you cannot open a file.

DARPA-BAA-13-21 document

Other (Draft RFPs/RFIs, Responses to Questions, etc..)
DARPA-BAA-13-21 document
Posted Date:
February 6, 2013
Description: DARPA-BAA-13-21 document
Description: Attachment 1: Proposer Checklist
Description: Attachment 2: SF1408
675 North Randolph Street
Arlington, Virginia 22203-2114
United States
Dr. Avram Bar-Cohen