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ICECool Applications (ICECool Apps)

Solicitation Number: DARPA-BAA-13-21
Agency: Other Defense Agencies
Office: Defense Advanced Research Projects Agency
Location: Contracts Management Office
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DARPA-BAA-13-21
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Presolicitation
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Added: Feb 06, 2013 4:09 pm
ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects. See the full DARPA-BAA-13-21 document attached.
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DARPA-BAA-13-21 document

Type:
Other (Draft RFPs/RFIs, Responses to Questions, etc..)
Label:
DARPA-BAA-13-21 document
Posted Date:
February 6, 2013
Description: DARPA-BAA-13-21 document
Description: Attachment 1: Proposer Checklist
Description: Attachment 2: SF1408
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675 North Randolph Street
Arlington, Virginia 22203-2114
United States
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Dr. Avram Bar-Cohen