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Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology

Solicitation Number: DARPA-BAA-12-16
Agency: Other Defense Agencies
Office: Defense Advanced Research Projects Agency
Location: Contracts Management Office
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Added: Mar 29, 2012 4:28 pm
The goal of the Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology BAA is to develop advanced heterogeneous integration processes, allowing diverse material systems and device technologies to be tightly integrated on a common silicon substrate. The DAHI program thrust aims to establish a manufacturable foundry technology to provide accessibility to a broad community of designers for innovative circuit or microsystem designs.

See the attached full DARPA-BAA-12-16 document.

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DARPA-BAA-12-16 document

Other (Draft RFPs/RFIs, Responses to Questions, etc..)
DARPA-BAA-12-16 document
Posted Date:
March 29, 2012
Description: DARPA-BAA-12-16 document
Description: Attachment 1: Cost Volume Proposer Checklist
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Arlington, Virginia 22203-1714
Dr. Sanjay Raman