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Sandia Cooler - A Fundamentally New Approach to Air-cooled Heat Exchangers for Electronics Chip Cooling

Solicitation Number: 11_360
Agency: Department of Energy
Office: Sandia Corp. (DOE Contractor)
Location: Sandia National Laboratories
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Special Notice
Added: Jun 17, 2011 1:00 pm Modified: Jul 07, 2011 5:44 pmTrack Changes
Sandia National Laboratories seeks licensees for patent application #12/185,570 [title "Heat Exchanger Device and Method for Heat Transfer or Removal"; inventor Jeff Koplow; filing date Aug. 4, 2008; US Patent Application Publication #2009/1099997 A1; SD #10948]. This patent application involves a novel, proprietary air-cooled heat exchanger technology, known as the "Sandia Cooler" or alternatively the "Air Bearing Heat Exchanger". The current solicitation regards licensing opportunities in the field of electronics chip cooling. Sandia will be establishing a separate process for exploring partnering and/or licensing opportunities in other fields.

In conventional chip cooling schemes, the heat transfer bottleneck is the boundary layer of "dead air" that clings to the cooling fins. In this new device architecture, heat is efficiently transferred across a narrow air gap from a stationary base to a rotating structure that combines the functionality of cooling fins with a centrifugal impeller. Dead air enveloping the cooling fins is subjected to a powerful centrifugal pumping effect, providing a 10x reduction in boundary layer thickness. This enables a dramatic improvement in cooling performance within a much smaller package. Additionally, high speed rotation minimizes the problem of heat exchanger fouling. The way in which the cooling fins slice through the air greatly improves aerodynamic efficiency, which translates to extremely quiet operation. The above benefits have been verified on a proof-of-concept prototype approximately sized for cooling of computer CPU's.

For further information, please reference the following:

• EERE Tech Portal:
• White paper:

Companies interested in licensing Sandia Cooler technology for chip cooling applications should provide the following: 1. Company name and address; 2. The name, e-mail address and telephone number of a point of contact; 3. A brief statement (no more than 500 words) of interest, intent and capabilities relevant to commercializing this technology.

Please e-mail responses, as well as questions, to Responses should be submitted by July 25, 2011.

Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Company, for the U.S. Department of Energy's National Nuclear Security Administration under Contract DE-AC04-94AL85000. SAND number: 2011-4128P


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